SN54HC652, SN74HC652

OCTAL BUS TRANSCEIVERS AND REGISTERS

WITH 3-STATE OUTPUTS

SCLS151E – DECEMBER 1982 – REVISED MARCH 2003

1

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

D Wide Operating Voltage Range of 2 V to 6 V

D High-Current 3-State Outputs Can Drive Up

To 15 LSTTL Loads

D Low Power Consumption, 80-µA Max ICC

D Typical tpd = 11 ns

D ±6-mA Output Drive at 5 V

D Low Input Current of 1 µA Max

D Independent Registers and Enables for

A and B Buses

D Multiplexed Real-Time and Stored Data

D True Data Paths

SN54HC652 ...JT OR W PACKAGE

SN74HC652 . . . DW OR NT PACKAGE

(TOP VIEW)

SN54HC652 . . . FK PACKAGE

(TOP VIEW)

NC – No internal connection

1

2

3

4

5

6

7

8

9

10

11

12

24

23

22

21

20

19

18

17

16

15

14

13

CLKAB

SAB

OEAB

A1

A2

A3

A4

A5

A6

A7

A8

GND

VCC

CLKBA

SBA

OEBA

B1

B2

B3

B4

B5

B6

B7

B8

32 1

13 14

5

6

7

8

9

10

11

OEBA

B1

B2

NC

B3

B4

B5

A1

A2

A3

NC

A4

A5

A6

4

15 16 17 18

28 27 26

12

25

24

23

22

21

20

19

description/ordering information

The ’HC652 devices consist of bus-transceiver circuits, D-type flip-flops, and control circuitry arranged for

multiplexed transmission of data directly from the data bus or from the internal storage registers. Output-enable

(OEAB and OEBA) inputs are provided to control the transceiver functions. Select-control (SAB and SBA) inputs

are provided to select real-time or stored-data transfer. A low input level selects real-time data, and a high input

level selects stored data. Figure 1 illustrates the four fundamental bus-management functions that can be

performed with these devices.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

PDIP – NT

Tube

SN74HC652NT

SN74HC652NT

–40

°C to 85°C

SOIC

DW

Tube

SN74HC652DW

HC652

SOIC – DW

Tape and reel

SN74HC652DWR

HC652

CDIP – JT

Tube

SNJ54HC652JT

SNJ54HC652JT

–55

°C to 125°C

CFP – W

Tube

SNJ54HC652W

SNJ54HC652W

LCCC – FK

Tube

SNJ54HC652FK

SNJ54HC652FK

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines

are available at www.ti.com/sc/package.

Copyright

 2003, Texas Instruments Incorporated

UNLESS OTHERWISE NOTED this document contains PRODUCTION

DATA information current as of publication date. Products conform to

specifications per the terms of Texas Instruments standard warranty.

Production processing does not necessarily include testing of all

parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.