AMC80

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SBOS559B – MAY 2011 – REVISED OCTOBER 2015

6 Specifications

6.1 Absolute Maximum Ratings

(1)

Over operating free-air temperature range, unless otherwise noted.

MIN

MAX

UNIT

Power-supply voltage range, V+

–0.3

7

V

Pins 6, 10, 15, 16, 17, 18, 19, 20, 21, 22, 24

–0.3

(V+) + 0.3

Input voltage range, VIN

V

Pins 1, 2, 3, 4, 5, 7, 9, 11, 12, 13, 23

–0.3

7

Input current, IIN

10

mA

Operating temperature range, TA

–55

127

°C

Junction temperature range, TJ max

150

°C

Storage temperature range, TSTG

–65

150

°C

(1)

Stresses above these ratings my cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

V

Machine model (MM)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. ance.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage range, V+

3

5.5

V

Input voltage range, VIN

–0.05

(V+) + 0.05

V

Operating temperature range, TA

–40

125

°C

6.4 Thermal Information

AMC80

THERMAL METRIC(1)

PW (TSSOP)

UNIT

24 PINS

RθJA

Junction-to-ambient thermal resistance

100.72

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

31.4

°C/W

RθJB

Junction-to-board thermal resistance

54.7

°C/W

ψJT

Junction-to-top characterization parameter

1.0

°C/W

ψJB

Junction-to-board characterization parameter

54.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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