BI Technologies IRC Welwyn

Solder pad layout (Inch / mm)

Wave Solder Process

Re-flow Solder Process

P

A

B

X

X1

Y

A

B

X

X1

Y

BCN 16 8RB / 8SB

.025

.048

.096

.012

.018

.024

.048

.096

.012

.018

.024

0.64

1.20

2.40

0.30

0.45

0.60

1.20

2.40

0.30

0.45

0.60

BCN 4D/4DBI

BCN 16 4A,

AB, ABI

BCN 31 8R, 8S

Wave Solder Process

Re-flow Solder Process

P

A

B

C

X

Y

A

B

C

X

Y

.050

.087

.169

.022

.028

.041

.087

.154

.022

.028

.034

1.27

2.20

4.30

0.57

0.70

1.05

2.20

3.90

0.57

0.70

0.85

.032

.039

.118

.014

.018

.039

.039

.118

.014

.018

.039

0.80

1.00

3.00

0.35

0.45

1.00

1.00

3.00

0.35

0.45

1.00

.050

.084

.148

.014

.036

.032

.084

.148

.014

.036

.032

1.27

2.10

3.70

0.35

0.90

0.80

2.10

3.70

0.35

0.90

0.80

BCN 16 4AB, 4ABI

BCN 31 Only

A

B

Y

Y

X

C

P

BCN 16 8RB / 8SB

Y

Y

B

A

P

X

X1

BCN Series

07.19

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

© TT Electronics plc

www.ttelectronics.com/resistors

Resistors

Thick Film Chip Arrays

OBSOLETE (BCN21 & CONCAVE OPTION ONLY)