ADC12DS080

SNAS443A – MARCH 2008 – REVISED MARCH 2013

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Pin Descriptions and Equivalent Circuits (continued)

Pin No.

Symbol

Equivalent Circuit

Description

Positive analog supply pins. These pins should be connected to a

8, 16, 17, 58,

VA

quiet source and be bypassed to AGND with 0.1 µF capacitors

60

located close to the power pins.

1, 4, 12, 15,

AGND

The ground return for the analog supply.

Exposed Pad

DIGITAL POWER

Positive driver supply pin for the output drivers. This pin should be

26, 40, 50

VDR

connected to a quiet voltage source and be bypassed to DRGND

with a 0.1 µF capacitor located close to the power pin.

The ground return for the digital output driver supply. This pins

25, 39, 51

DRGND

should be connected to the system digital ground, but not be

connected in close proximity to the ADC's AGND pins.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

Supply Voltage (VA, VDR)

−0.3V to 4.2V

Voltage on Any Pin (Not to exceed 4.2V)

−0.3V to (VA +0.3V)

Input Current at Any Pin other than Supply Pins(4)

±5 mA

Package Input Current(4)

±50 mA

Max Junction Temp (TJ)

+150°C

Thermal Resistance (

θJA)

30°C/W

ESD Rating

Human Body Model(5)

2500V

Machine Model(5)

250V

Storage Temperature

−65°C to +150°C

Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(6)

(1)

All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is ensured to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance

characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the

maximum Operating Ratings is not recommended.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be

limited to ±5 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power

supplies with an input current of ±5 mA to 10.

(5)

Human Body Model is 100 pF discharged through a 1.5 k

Ω resistor. Machine Model is 220 pF discharged through 0 Ω

(6)

Reflow temperature profiles are different for lead-free and non-lead-free packages.

Operating Ratings

(1) (2)

Operating Temperature

−40°C ≤ TA ≤ +85°C

Supply Voltage (VA=VDR)

+2.7V to +3.6V

Clock Duty Cycle

(DCS Enabled)

30/70 %

(DCS disabled)

45/55 %

VCM

1.4V to 1.6V

|AGND-DRGND|

≤100mV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is ensured to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance

characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the

maximum Operating Ratings is not recommended.

(2)

All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified.

6

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