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TS1935 Datasheet(PDF) 2 Page - Taiwan Semiconductor Company, Ltd

Part # TS1935
Description  1.6MHz Boost Converter with 30V Internal FET Switch
PDF  8 Pages
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Manufacturer  TSC [Taiwan Semiconductor Company, Ltd]
Direct Link  http://www.taiwansemi.com
Logo TSC - Taiwan Semiconductor Company, Ltd

TS1935 Datasheet(HTML) 2 Page - Taiwan Semiconductor Company, Ltd

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TS1935
1.6MHz Boost Converter
with 30V Internal FET Switch
2/8
Version: A07
Absolute Maximum Rating
Parameter
Symbol
Limit
Unit
Input Voltage
VIN
6
V
EN, VFB Voltage
VEN, VFB
VIN
V
SW Voltage
VSW
30
V
Ambient Temperature Range
TA
-40 to +85
oC
Junction Temperature Range
TJ
-40 to +125
oC
Storage Temperature Range
TSTG
-65 to +150
oC
ESD Classification
B*
Note: Stress above the listed absolute maximum rating may cause permanent damage to the device
* HBM B: 2000~3999V
Thermal Information
Parameter
Symbol
Maximum
Unit
Thermal Resistance* (Junction to Case)
ӨJC
81
oC/W
Thermal Resistance* (Junction to Ambient)
ӨJA
260
oC/W
Internal Power Dissipation
PD
400
mW
Maximum Junction Temperature
150
oC
Solder Iron (10 Sec)**
350
oC
* Measure ӨJC on center of molding compound if IC has no tab.
** MIL-STD-202G210F
Pin Description
Pin Number
Pin Name
Description
1
SW
Power Switch Input.
This is the drain of the internal NMOS power switch.
Minimize the metal trace area connected to this pin to minimize EMI.
2
GND
Ground. Tie directly to ground plan.
3
FB
Output voltage feedback input.
Set the output voltage by selecting values for R1 and R2 using:
Connect the ground of the feedback network to a GND plane.
4
EN
Enable, active high.
The enable pin is an active high control. Tie this pin above 2V to enable the device.
Tie this pin below 0.4V to turn off the device.
5
IN
Analog and Power input. Input Supply Pin.
Place bypass capacitor as close to Vin as possible.



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