Top View

A

B

C

D

E

1

2

3

4

5

6

7

Bottom View

E

D

C

B

A

1

2

3

4

5

6

7

LM2755

SNVS433D – OCTOBER 2007 – REVISED APRIL 2013

www.ti.com

Connection Diagram

Figure 3. 18-Bump Thin DSBGA Package

1.615mm × 1.807mm × 0.6mm

(See Package Number YFQ0018AAA)

PIN DESCRIPTIONS

Pin #s

Pin Names

Pin Descriptions

A1

ID1

LED Driver 1

A3

ID2

LED Driver 2

A5

ID3

LED Driver 3

A7

SYNC

External clock synchronization input

B2

ISET

LED Driver Current Set Pin

B4

HWEN

Hardware EN Pin. Low '0' = RESET, High '1' = Normal Operation

B6

SDIO

Serial data Input/Output pin

C1

VIN

Input Voltage Connection

C3

GND

Ground Connection.

C5

VIO

Serial Bus Voltage Level Input

C7

SCL

Serial Clock Pin

D2

POUT

Charge Pump Output

D4

C2-

Flying Capacitor Connect

D6

GND

Ground connection

E1

C1+

Flying Capacitor Connect

E3

C2+

Flying Capacitor Connect

E5

C1-

Flying Capacitor Connect

E7

ADDR

Chip Address Select Input. VIN = 0x67. Ground = 0x18.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

2

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