LM48512

SNAS497A – OCTOBER 2010 – REVISED APRIL 2012

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Absolute Maximum Ratings

(1) (2)

Supply Voltage (VDD)

(1)

6.0V

Storage Temperature

−65°C to +150°C

Power Dissipation (3)

Internally Limited

ESD Rating (4)

2000V

ESD Rating (5)

200V

Junction Temperature

150°C

Thermal Resistance

θJA (TLA16QSA)

50°C/W

Soldering Information

See AN-1112 “Micro SMD Wafer Level Chip

Scale Package”

(1)

“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating

Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. All

voltages are measured with respect to the ground pin, unless otherwise specified.

(2)

The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as

otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and

are not guaranteed.

(3)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature,

TA. The maximum allowable power dissipation is PDMAX = (TJMAX − TA) / θJA or the number given in Absolute Maximum Ratings,

whichever is lower.

(4)

Human body model, applicable std. JESD22-A114C.

(5)

Machine model, applicable std. JESD22-A115-A.

Operating Ratings

Temperature Range

TMIN ≤ TA ≤ TMAX

−40°C ≤ TA ≤ +85°C

Supply Voltage

2.3V

≤ VDD ≤ 5.5V

4

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