LMT89

SNIS176A – MARCH 2013 – REVISED JANUARY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply Voltage

−0.2

6.5

V

Output Voltage

(V+ + 0.6 V)

−0.6

V

Output Current

10

mA

Input Current at any pin(3)

5

mA

Maximum Junction Temperature (TJMAX)

150

°C

Storage temperature (Tstg)

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Soldering process must comply with the Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.. Reflow

temperature profiles are different for lead-free and non-lead-free packages.

(3)

When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V

+), the current at that pin should be limited to 5 mA.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(2)

±2500

V(ESD)

(1)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±250

C101(3)

(1)

Accuracy is defined as the error between the measured and calculated output voltage at the specified conditions of voltage, current, and

temperature (expressed in°C).

(2)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

LMT89 with 2.4 V

≤ V+ ≤ 2.7 V

−30

130

°C

LMT89 with 2.7 V

≤ V+ ≤ 5.5 V

−55

130

°C

Supply Voltage Range (V+)

2.4

5.5

V

6.4 Thermal Information

LMT89

THERMAL METRIC(1)

SOT

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

282

RθJC(top)

Junction-to-case (top) thermal resistance

93

RθJB

Junction-to-board thermal resistance

62

°C/W

ψJT

Junction-to-top characterization parameter

1.6

ψJB

Junction-to-board characterization parameter

62

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. For

measured thermal resistance using specific printed circuit board layouts for the LMT89, see Layout.

4

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