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ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

PACKAGE SPECIFICATIONS

PTH04070W

SLTS227B – SEPTEMBER 2004 – REVISED OCTOBER 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

over operating free-air temperature range unless otherwise noted

(1)

PTH04070

UNIT

TA

Operating free-air

Over VI range

-40 to 85

temperature

Twave

Wave solder

Surface temperature of module body or pins

Suffix AH & AD

260

temperature

(5 seconds maximum)

°C

Treflow

Solder reflow

Surface temperature of module body or pins

Suffix AS

235(2)

temperature

Suffix AZ

260(2)

Tstg

Storage temperature

-55 to 125(3)

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above the

stated maximum.

(3)

The shipping tray or tape and reel cannot be used to bake parts at temperatures higher than 65

°C.

MIN

MAX

UNIT

VI

Input voltage

3

5.5

V

TA

Operating free-air temperature

–40

85

°C

PTH04070WXX

Weight

1.5 grams

Flammability

Meets UL 94 V-O

Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine,

Mechanical shock

500 G (1)

mounted

Mechanical vibration

Mil-STD-883D, Method 2007.2, 20-2000 Hz

20 G (1)

(1)

Qualification limit.

2

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