SN54AC00-DIE

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SCHS391A – APRIL 2013 – REVISED NOVEMBER 2013

Table 1. Bond Pad Coordinates in Microns

DESCRIPTION

PAD NUMBER

X MIN

Y MIN

X MAX

Y MAX

1A

1

96.25

510.5

201.25

615.5

1B

2

95

94

200

199

1Y

3

508

94

613

199

2A

4

1149

94

1254

199

2B

5

1562

94

1667

199

2Y

6

1841.5

145.5

1946.5

250.5

GND

7

1841.5

445.5

1946.5

550.5

3Y

8

1841

783

1946

888

3A

9

1750.5

991

1855.5

1096

3B

10

1176.5

991

1281.5

1096

4Y

11

921

991

1026

1096

4A

12

736

991

841

1096

4B

13

95

991

200

1096

VCC

14

102.5

692

207.5

797

xxx

REVISION HISTORY

Changes from Original (April 2013) to Revision A

Page

•

Changed bare die diagram ................................................................................................................................................... 2

•

Changed Bond Pad Coordinates .......................................................................................................................................... 3

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