UVblade

Laser Lift-Off Processing

UVblade gently detaches delicate polymer-based displays of all types

from their rigid glass carriers. Laser Lift-Off separation is the enabling

technology in manufacturing flexible displays. UVblade is available at

variable line beam lengths supporting fast and effective separation of

substrates and wafers.

FEATURES & BENEFITS

• Cost effective solutions for

Laser Lift-Off (LLO) separation

• Pulse on Demand (POD)

• Unmatched beam utilization

• Scalability in line lengths and

energy density

• Felxible system footprint

APPLICATIONS

• Laser Lift-Off Separation

of Wafers and Displays

• Unique Lift-Off Solution for

Transparent and Colorless

Polyimide (CPI)