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LWP473 Datasheet(PDF) 11 Page - OSRAM GmbH |
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LWP473 Datasheet(HTML) 11 Page - OSRAM GmbH |
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11 / 17 page  LW P473 2006-05-03 11 Empfohlenes Lötpaddesign 8) Seite 17 IR Reflow Löten Recommended Solder Pad 8) page 17 IR Reflow Soldering Empfohlenes Lötpaddesign 8) Seite 17 IR Reflow Löten, montage von oben Recommended Solder Pad 8) page 17 IR Reflow Soldering, top mount OHAY1307 Hole in PCB Solder resist Lötstoplack (ø2.1 (0.083) 2.6 (0.102) 3.6 (0.142) (0.5 (0.020)) +0.1 (0.004) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation Bauteil positioniert, Rückseite Component location on pad, backside ) OHAY2629 Lötstoplack Solder resist ø2.3 (0.091) 2.6 (0.102) 0.7 (0.028) No solder resist; no copper pad Kein Lötstoplack; kein Kupfer |
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