Water Insoluble Nitride Thin Film Precision Chip Resistors

WIN Series

www.ttelectronicsresistors.com

Performance Data

Test

Method

ΔR

MIL-PRF-55342

Limits (max)

WIN actual

performance (typ)

Thermal Shock

MIL-PRF-55342 4.8.3 (MIL-STD-202 107G cond. F: 5 cycles in air, +150 / -65°C)

± 0.1%

± 0.025%

Low Temp. Operation

MIL-PRF-55342 4.8.5 (-65°C)

± 0.1%

± 0.02%

Short Time Overload

MIL-PRF-55342 4.8.6 (lesser of 6.25 x Pr or 2 x LEV for 5 seconds)

± 0.1%

± 0.02%

High Temp. Exposure

MIL-PRF-55342 4.8.7 (+150°C for 100 hours)

± 0.1%

± 0.05%

Resistance to Solder Heat MIL-PRF-55342 4.8.8

± 0.2%

± 0.02%

Moisture Resistance

MIL-PRF-55342 4.8.9 (MIL-STD-202 106G: 10 cycles, 65±2°C, 95±5% RH)

± 0.2%

± 0.01%

Load Life

MIL-PRF-55342 4.8.11 (MIL-STD-202 108A: Pr at 70°C for 2000 hours)

± 0.5%

± 0.08%

Biased Damp Heat

85°C, 85%RH, 10% Pr bias, for 2000 hours

N/A

± 0.08%

Flower of Sulfur

ASTM B-809 (modified) 105°C Dry, 1000 Hours

Pass

0%

20%

40%

60%

80%

100%

0

50

100

150

Ambient Temperature (°C

)

Temperature Derating

-0.10%

-0.05%

0.00%

0.05%

0.10%

0

500

1000

1500

2000

Time on Test (hours)

Load Life Stability

Typical Load Life per MIL-STD-202 108A

0.00%

0.01%

0.02%

0.03%

0.04%

0.05%

0.06%

0

500

1000

1500

2000

Time on Test (hours)

Biased Damp Heat Stability

Typical @ 85°C, 85%RH, 10% Pr bias

70kΩ

100Ω

100Ω

70kΩ

25kΩ

500Ω

Water Insoluble Nitride Thin Film Precision Chip Resistors

WIN Series

www.ttelectronicsresistors.com

Performance Data

Test

Method

ΔR

MIL-PRF-55342

Limits (max)

WIN actual

performance (typ)

Thermal Shock

MIL-PRF-55342 4.8.3 (MIL-STD-202 107G cond. F: 5 cycles in air, +150 / -65°C)

± 0.1%

± 0.025%

Low Temp. Operation

MIL-PRF-55342 4.8.5 (-65°C)

± 0.1%

± 0.02%

Short Time Overload

MIL-PRF-55342 4.8.6 (lesser of 6.25 x Pr or 2 x LEV for 5 seconds)

± 0.1%

± 0.02%

High Temp. Exposure

MIL-PRF-55342 4.8.7 (+150°C for 100 hours)

± 0.1%

± 0.05%

Resistance to Solder Heat MIL-PRF-55342 4.8.8

± 0.2%

± 0.02%

Moisture Resistance

MIL-PRF-55342 4.8.9 (MIL-STD-202 106G: 10 cycles, 65±2°C, 95±5% RH)

± 0.2%

± 0.01%

Load Life

MIL-PRF-55342 4.8.11 (MIL-STD-202 108A: Pr at 70°C for 2000 hours)

± 0.5%

± 0.08%

Biased Damp Heat

85°C, 85%RH, 10% Pr bias, for 2000 hours

N/A

± 0.08%

Flower of Sulfur

ASTM B-809 (modified) 105°C Dry, 1000 Hours

Pass

0%

20%

40%

60%

80%

100%

0

50

100

150

Ambient Temperature (°C

)

Temperature Derating

-0.10%

-0.05%

0.00%

0.05%

0.10%

0

500

1000

1500

2000

Time on Test (hours)

Load Life Stability

Typical Load Life per MIL-STD-202 108A

0.00%

0.01%

0.02%

0.03%

0.04%

0.05%

0.06%

0

500

1000

1500

2000

Time on Test (hours)

Biased Damp Heat Stability

Typical @ 85°C, 85%RH, 10% Pr bias

70kΩ

100Ω

100Ω

70kΩ

25kΩ

500Ω

Water Insoluble Nitride Thin Film Precision Chip Resistors

WIN Series

www.ttelectronicsresistors.com

Performance Data

Test

Method

ΔR

MIL-PRF-55342

Limits (max)

WIN actual

performance (typ)

Thermal Shock

MIL-PRF-55342 4.8.3 (MIL-STD-202 107G cond. F: 5 cycles in air, +150 / -65°C)

± 0.1%

± 0.025%

Low Temp. Operation

MIL-PRF-55342 4.8.5 (-65°C)

± 0.1%

± 0.02%

Short Time Overload

MIL-PRF-55342 4.8.6 (lesser of 6.25 x Pr or 2 x LEV for 5 seconds)

± 0.1%

± 0.02%

High Temp. Exposure

MIL-PRF-55342 4.8.7 (+150°C for 100 hours)

± 0.1%

± 0.05%

Resistance to Solder Heat MIL-PRF-55342 4.8.8

± 0.2%

± 0.02%

Moisture Resistance

MIL-PRF-55342 4.8.9 (MIL-STD-202 106G: 10 cycles, 65±2°C, 95±5% RH)

± 0.2%

± 0.01%

Load Life

MIL-PRF-55342 4.8.11 (MIL-STD-202 108A: Pr at 70°C for 2000 hours)

± 0.5%

± 0.08%

Biased Damp Heat

85°C, 85%RH, 10% Pr bias, for 2000 hours

N/A

± 0.08%

Flower of Sulfur

ASTM B-809 (modified) 105°C Dry, 1000 Hours

Pass

0%

20%

40%

60%

80%

100%

0

50

100

150

Ambient Temperature (°C

)

Temperature Derating

-0.10%

-0.05%

0.00%

0.05%

0.10%

0

500

1000

1500

2000

Time on Test (hours)

Load Life Stability

Typical Load Life per MIL-STD-202 108A

0.00%

0.01%

0.02%

0.03%

0.04%

0.05%

0.06%

0

500

1000

1500

2000

Time on Test (hours)

Biased Damp Heat Stability

Typical @ 85°C, 85%RH, 10% Pr bias

70kΩ

100Ω

100Ω

70kΩ

25kΩ

500Ω

WIN Series

Water Insoluble Nitride Thin Film

Precision Chip Resistors

Test

Method

ΔR

MIL-PRF-55342

Limits (max)

WIN actual

performance (typ)

Thermal Shock

MIL-PRF-55342 4.8.3 (MIL-STD-202 107G cond. F: 5 cycles in air, +150 / -65°C)

± 0.1%

± 0.01%

Thermal Shock - Extended

MIL-STD-202 107G cond. F-3: 100 cycles in air, +150 / -65°C

± 0.1%

± 0.02%

Low Temp. Operation

MIL-PRF-55342 4.8.5 (-65°C)

± 0.1%

± 0.02%

Short Time Overload

MIL-PRF-55342 4.8.6 (lesser of 6.25 x Pr or 2 x LEV for 5 seconds)

± 0.1%

± 0.02%

High Temp. Exposure

MIL-PRF-55342 4.8.7 (+150°C for 100 hours)

± 0.1%

± 0.02%

High Temp. Exposure Extended +150°C for 1000 hours

N/A

±0.1%

Resistance to Solder Heat

MIL-PRF-55342 4.8.8

± 0.2%

± 0.02%

Moisture Resistance

MIL-PRF-55342 4.8.9 (MIL-STD-202 106G: 10 cycles, 65±2°C, 95±5% RH)

± 0.2%

± 0.01%

Load Life

MIL-PRF-55342 4.8.11 (MIL-STD-202 108A: Pr at 70°C for 2000 hours)

± 0.5%

± 0.08%

Biased Damp Heat

85°C, 85%RH, 10% Pr bias, for 2000 hours

N/A

± 0.08%

Flower of Sulfur

ASTM B-809 (modified) 105°C Dry, 1000 Hours

Pass

EIA-977 Condition B, 105°C Dry, 750 Hours

TCR

ppm/°C

Tolerance %

T0402

T0603

T0805

T1206

0.1-1

0.05

0.1-1

0.05

0.1-1

0.05

0.1-1

10

5kΩ-10kΩ

5kΩ-40kΩ

5kΩ-80kΩ

15

100Ω-50kΩ

100Ω-100kΩ

100Ω-400kΩ

25

10Ω-30kΩ

50Ω-50kΩ

10Ω-100kΩ

50Ω-100kΩ

10Ω-267kΩ

50Ω-400kΩ

10Ω-1MΩ

50

7.5Ω-30kΩ

4.99Ω-100kΩ

4.99Ω-267kΩ

4.99Ω-1MΩ

Performance Data

Manufacturing Capabilities Data

01.23

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

© TT Electronics plc

www.ttelectronics.com/resistors

BI Technologies IRC Welwyn

OBSOLETE