II. Manufacturing Information

A. Description/Function:

Quick-PWM Slave Controllers for Multiphase, Step-Down Supplies

B. Process:

S12 – Silicon Gate 1.2 micron CMOS

C. Number of Device Transistors:

1422

D. Fabrication Location:

Oregon or California, USA

E. Assembly Location:

Malaysia, Thailand or Philippines

F. Date of Initial Production:

October, 2001

III. Packaging Information

A. Package Type:

16-Lead QSOP

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Silver-filled epoxy

E. Bondwire:

Gold (1.3 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Bonding Diagram

05-3801-0006

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1

IV. Die Information

A. Dimensions:

86 x 91 mils

B. Passivation:

C. Interconnect:

Aluminum

D. Backside Metallization:

None

E. Minimum Metal Width:

1.2 microns (as drawn)

F. Minimum Metal Spacing:

1.2 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

I. Die Separation Method:

Wafer Saw