4 Specifications

4.1 Absolute Maximum Ratings

MIN

MAX

UNIT

VCC

Supply voltage range

-0.5

7

V

IIK

Input diode current

( VI < -0.5 V or VI > VCC ±

0.5 V)

±20

mA

IOK

Output diode current

(VO < -0.5 V or VO > VCC +

0.5 V)

±50

mA

IO

Output source or sink current per output pin

(VO > -0.5 V or VO < VCC +

0.5 V)

±50

mA

VCC or ground current, ICC or IGND

±100

mA

(1)

TA

Operating-temperature range

-55

+125

°C

Tstg

Storage temperature

-65

+150

°C

(1)

For up to 4 outputs per device; add ± 25 mA for each additional output.

4.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

4.3 Recommended Operating Conditions:

For maximum reliability, normal operating conditions should be selected so that operation is always within the following

ranges:

MIN

MAX

UNIT

VCC

(1)

Supply-Voltage :

(For TA = Full Package-Temperature Range)

AC Types

1.5

5.5

V

ACT Types

4.5

5.5

V

VI, VO

Input or Output voltage

0

VCC

V

TA

Operating Temperature

-55

+125

°C

dt/dv

Input Rise and Fall Slew Rate

at 1.5 V to 3 V (AC Types)

0

50

ns/V

at 3.6 V to 5.5 V (AC Types)

0

20

ns/V

at 4.5 V to 5.5 V (ACT Types)

0

10

ns/V

(1)

Unless otherwise specified, all voltages are referenced to ground.

4.4 Thermal Information

THERMAL METRIC(1)

CDx4AC(T)299/

CD74AC323

UNIT

DW (SOIC, 20)

20 PINS

RθJA

Junction-to-ambient thermal resistance

40

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

CD54AC299, CD74AC299, CD74AC323, CD54ACT299, CD74ACT299

SCHS288A – DECEMBER 1998 – REVISED DECEMBER 2024

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