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EXAMPLE STENCIL DESIGN

16X (1.65)

16X (0.6)

14X (1.27)

(9.75)

16X (2)

16X (0.6)

14X (1.27)

(9.3)

4221009/A 08/2013

SOIC - 2.65 mm max height

DW0016B

SOIC

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SYMM

SYMM

1

8

9

16

HV / ISOLATION OPTION

8.1 mm CLEARANCE/CREEPAGE

BASED ON 0.125 mm THICK STENCIL

SOLDER PASTE EXAMPLE

SCALE:4X

SYMM

SYMM

1

8

9

16

IPC-7351 NOMINAL

7.3 mm CLEARANCE/CREEPAGE

31

ISO7631FM, ISO7631FC, ISO7641FC

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SLLSEC3F – SEPTEMBER 2012 – REVISED APRIL 2016

Product Folder Links: ISO7631FM ISO7631FC ISO7641FC

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