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LM3102 Datasheet(PDF) 13 Page - Texas Instruments |
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LM3102 Datasheet(HTML) 13 Page - Texas Instruments |
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13 / 30 page ![]() 13 LM3102-Q1 www.ti.com SNVSB33 – MAY 2018 Product Folder Links: LM3102-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Feature Description (continued) An internal switch grounds the SS pin if any of the following three cases happens: (i) VCC is below the UVLO threshold; (ii) a thermal shutdown occurs; or (iii) the EN pin is grounded. Alternatively, the output voltage can be shut off by connecting the SS pin to ground using an external switch. Releasing the switch allows the SS pin to ramp up and the output voltage to return to normal. The shutdown configuration is shown in Figure 20. Figure 20. Alternate Shutdown Implementation 7.3.9 Thermal Protection The junction temperature of the LM3102-Q1 should not exceed the maximum limit. Thermal protection is implemented by an internal Thermal Shutdown circuit, which activates (typically) at 165°C to make the controller enter a low power reset state by disabling the main MOSFET, disabling the ON-timer, and grounding the SS pin. Thermal protection helps prevent catastrophic failures from accidental device overheating. When the junction temperature falls back below 145°C (typical hysteresis = 20°C), the SS pin is released and normal operation resumes. 7.3.10 Thermal Derating The LM3102-Q1 can supply 2.5 A below an ambient temperature of 100°C. Under worst-case operation, with either input voltage up to 42 V, operating frequency up to 1 MHz, or voltage of the RON pin below the absolute maximum of 7 V, the LM3102-Q1 can deliver a minimum of 1.9-A output current without thermal shutdown with a PCB ground plane copper area of 40 cm2, 2 oz/Cu. Figure 21 shows a thermal derating curve for the minimum output current without thermal shutdown against ambient temperature up to 125°C. Obtaining 2.5-A output current is possible by increasing the PCB ground plane area, or reducing the input voltage or operating frequency. Figure 21. Thermal Derating Curve |
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