5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

28

V

Differential input voltage : VID (2)

±28

V

Input pins (IN+, IN–)

-0.3

28

V

Current into input pins (IN+, IN–)

-20

mA

Output pin (OUT)

-0.3

28

V

Output sink current

20

mA

Output short-circuit duration(3)

Unlimited

s

Junction temperature, TJ

150

°C

Storage temperature, Tstg

-65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods can affect device

reliability.

(2)

Differential voltages are at IN+ with respect to IN-

(3)

Short circuits from outputs to V+ can cause excessive heating and eventual destruction.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Human-body model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

2

28

V

Ambient temperature, TA

–40

85

°C

Input Voltage Range, VIVR

V-

(V+) – 2.0

V

Output Voltage

V-

28

V

5.4 Thermal Information

THERMAL METRIC(1)

LM3302

UNIT

N

(PDIP)

D

(SOIC)

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

114.9

111.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

93.8

66.9

°C/W

RθJB

Junction-to-board thermal resistance

77.7

67.8

°C/W

ψJT

Junction-to-top characterization parameter

60.4

28.0

°C/W

ψJB

Junction-to-board characterization parameter

76.7

67.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics report,

SPRA953.

LM3302

SLCS014B – OCTOBER 1977 – REVISED APRIL 2025

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