8 Device and Documentation Support

8.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

8.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.3 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.5 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (August 2003) to Revision B (April 2025)

Page

• Updated to current TI data sheet format. No changes to Electrical Table specs................................................1

• Updated ESD table for new packages................................................................................................................4

• Updated Thermal Information table for new packages.......................................................................................4

• Added Typical Graphs........................................................................................................................................ 6

• Updated Functional Block Diagram.................................................................................................................... 8

Changes from Revision * (October 1977) to Revision A (August 2003)

Page

• Removed Ceramic 'J' package. Added SOIC ordering options.......................................................................... 1

LM3302

SLCS014B – OCTOBER 1977 – REVISED APRIL 2025

www.ti.com

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Product Folder Links: LM3302