2

SN74LVC1404

SCES469F – AUGUST 2003 – REVISED MARCH 2020

www.ti.com

Product Folder Links: SN74LVC1404

Submit Documentation Feedback

Copyright © 2003–2020, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Simplified Schematic............................................. 1

5

Revision History..................................................... 2

6

Pin Configuration and Functions ......................... 3

7

Specifications......................................................... 4

7.1

Absolute Maximum Ratings ..................................... 4

7.2

ESD Ratings.............................................................. 4

7.3

Recommended Operating Conditions ...................... 5

7.4

Thermal Information .................................................. 5

7.5

Electrical Characteristics........................................... 6

7.6

Switching Characteristics, CL = 15 pF ...................... 7

7.7

Switching Characteristics, CL = 30 pF or 50 pF........ 7

7.8

Operating Characteristics.......................................... 7

7.9

Typical Characteristics .............................................. 7

8

Parameter Measurement Information .................. 8

9

Detailed Description ............................................ 10

9.1

Overview ................................................................. 10

9.2

Functional Block Diagram ....................................... 10

9.3

Feature Description................................................. 10

9.4

Device Functional Modes........................................ 11

10

Application and Implementation........................ 12

10.1

Application Information.......................................... 12

10.2

Typical Application ............................................... 12

11

Power Supply Recommendations ..................... 17

12

Layout................................................................... 17

12.1

Layout Guidelines ................................................. 17

12.2

Layout Example .................................................... 17

13

Device and Documentation Support ................. 18

13.1

Trademarks ........................................................... 18

13.2

Electrostatic Discharge Caution ............................ 18

13.3

Glossary ................................................................ 18

14

Mechanical, Packaging, and Orderable

Information ........................................................... 18

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (June 2014) to Revision F

Page

•

Formatted pinout figures for search capability ....................................................................................................................... 3

•

Corrected pin numbering for the DSBGA package to match the mechanical drawing ......................................................... 3

•

Changed ESD Ratings table format to comply with JEDEC standards ................................................................................ 4

•

Added YZP TA MIN /MAX specs and package thermal information ...................................................................................... 5

Changes from Revision D (January 2007) to Revision E

Page

•

Updated document to new TI data sheet format. ................................................................................................................... 1

•

Removed Ordering Information table. ................................................................................................................................... 1

•

Added Applications. ................................................................................................................................................................ 1

•

Added Device Information table. ............................................................................................................................................ 1

•

Added Handling Ratings table. .............................................................................................................................................. 4

•

Changed MAX ambient temperature to 125°C....................................................................................................................... 5

•

Added Thermal Information table. .......................................................................................................................................... 5

•

Added Typical Characteristics. .............................................................................................................................................. 7