5

TDP142

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SLLSEZ1C – SEPTEMBER 2017 – REVISED MAY 2019

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Copyright © 2017–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the GND terminals.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage Range(2), VCC

–0.3

4

V

Voltage Range at any input or output pin

Differential voltage between positive and

negative inputs

–2.5

2.5

V

Voltage at differential inputs

–0.5

VCC + 0.5

V

CMOS Inputs

–0.5

VCC + 0.5

V

Maximum junction temperature, TJ

125

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±5000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Main power supply

3

3.3

3.6

V

Supply Ramp Requirement

100

ms

V(12C)

Supply that external resistors are pulled up to on SDA and SCL

1.7

3.6

V

V(PSN)

Supply Noise on VCC pins

100

mV

TA

Operating free-air temperature

TDP142

0

70

°C

TDP142I

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TDP142

UNIT

RNQ (WQFN)

40 PINS

RθJA

Junction-to-ambient thermal resistance

37.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

20.7

°C/W

RθJB

Junction-to-board thermal resistance

9.5

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

9.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

2.3

°C/W