TPS22934

SLVSAD4B – AUGUST 2010 – REVISED APRIL 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

Input voltage

–0.3

4

V

VOUT

Output voltage

VIN + 0.3

V

VON

Control input voltage

–0.3

4

V

IMAX

Maximum continuous switch current, TA = –40°C to 85°C

1

A

IPLS

Maximum pulsed switch current, 100-µs pulse, 2% duty cycle, TA = –40°C to 85°C

1.4

A

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±3000

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±1000

pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VIN

Input voltage

1.5

3.6

V

VON

Control input voltage

0

3.6

VOUT

Output voltage

VIN

V

CIN

Input capacitance

1(1)

µF

TA

Operating free-air temperature

–40

85

°C

(1)

See the Input Capacitor section in Application Information.

6.4 Thermal Information

TPS22934

THERMAL METRIC(1)

YZV (DSBGA)

UNIT

4 PINS

RθJA

Junction-to-ambient thermal resistance

189.1

RθJC(top)

Junction-to-case (top) thermal resistance

1.9

RθJB

Junction-to-board thermal resistance

36.8

°C/W

ψJT

Junction-to-top characterization parameter

11.3

ψJB

Junction-to-board characterization parameter

36.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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