BUF08821

SBOS438D

– AUGUST 2008 – REVISED JULY 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION(1)

PRODUCT

PACKAGE

PACKAGE DESIGNATOR

PACKAGE MARKING

BUF08821A

HTSSOP-20

PWP

BUF08821

BUF08821B

HTSSOP-20

PWP

BUF8821B

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

BUF08821

UNIT

Supply Voltage, VS

+22

V

Supply Voltage, VSD

+6

V

Digital Input Terminals, SCL, SDA, AO, BKSEL: Voltage

–0.5 to +6

V

Digital Input Terminals, SCL, SDA, AO, BKSEL: Current

±10

mA

Output Pins, OUT1 Through OUT8, VCOM

(2)

(V

–) – 0.5 to (V+) + 0.5

V

Output Short-Circuit(3)

Continuous

Operating Temperature

–40 to +95

°C

Storage Temperature

–65 to +150

°C

Junction Temperature

+125

°C

Human Body Model (HBM)

4000

V

ESD Ratings

Charged-Device Model (CDM)

1000

V

Machine Model (MM)

200

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

See the Output Pins ESD Protection Current-Steering Diodes section.

(3)

Short-circuit to ground, one channel at a time.

2

Copyright

© 2008–2011, Texas Instruments Incorporated