5.4 Thermal Information

THERMAL METRIC(1)

CD4053B-Q1

UNIT

D (SOIC)

PW (TSSOP)

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

86.7

116.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

47.3

47.2

°C/W

RθJB

Junction-to-board thermal resistance

45.3

63.0

°C/W

ΨJT

Junction-to-top characterization parameter

12.1

6.4

°C/W

ΨJB

Junction-to-board characterization parameter

44.9

62.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

CD4053B-Q1

SCHS469 – MARCH 2025

Copyright © 2025 Texas Instruments Incorporated

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