ADC081S051

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SNAS309F – APRIL 2005 – REVISED JANUARY 2014

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

Analog Supply Voltage VA

−0.3V to 6.5V

Voltage on Any Analog Pin to GND

−0.3V to (VA +0.3V)

Voltage on Any Digital Pin to GND

−0.3V to 6.5V

Input Current at Any Pin(4)

±10 mA

Package Input Current(4)

±20 mA

Power Consumption at TA = 25°C

See(5)

Human Body Model

3500V

ESD Susceptibility(6)

Machine Model

300V

Junction Temperature

+150°C

Storage Temperature

−65°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(2)

All voltages are measured with respect to GND = 0V, unless otherwise specified.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin should be limited to

10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an

input current of 10 mA to two. The Absolute Maximum Rating specification does not apply to the VA pin. The current into the VA pin is

limited by the Analog Supply Voltage specification.

(5)

The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by

TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula

PDMAX = (TJmax − TA)/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in

a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is

reversed). Obviously, such conditions should always be avoided.

(6)

Human body model is 100 pF capacitor discharged through a 1.5 k

Ω resistor. Machine model is 220 pF discharged through zero ohms

Operating Ratings

(1) (2)

Operating Temperature Range

−40°C ≤ TA ≤ +85°C

VA Supply Voltage

+2.7V to +5.25V

Digital Input Pins Voltage Range (regardless of supply voltage)

−0.3V to 5.25V

Analog Input Pins Voltage Range

0V to VA

Clock Frequency

25 kHz to 20 MHz

Sample Rate

up to 1Msps

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(2)

All voltages are measured with respect to GND = 0V, unless otherwise specified.

Package Thermal Resistance

(1)

Package

θJA

6-lead WSON

94°C / W

6-lead SOT-23

265°C / W

(1)

Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. Reflow temperature

profiles are different for lead-free and non-lead-free packages.

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