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AMC1336-Q1

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SBASA51 – MAY 2020

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

AMC1336-Q1

UNIT

DWV (SOIC)

8 PINS

RθJA

Junction-to-ambient thermal resistance

94

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

36

°C/W

RθJB

Junction-to-board thermal resistance

46.1

°C/W

ψJT

Junction-to-top characterization parameter

11.5

°C/W

ψJB

Junction-to-board characterization parameter

44.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

VALUE

UNIT

PD

Maximum power dissipation (both sides)

AVDD = DVDD = 5.5 V

90.75

mW

AVDD = DVDD = 3.6 V

50.4

PD1

Maximum power dissipation (high-side supply)

AVDD = 5.5 V

57.75

mW

AVDD = 3.6 V

32.4

PD2

Maximum power dissipation (controller-side supply)

DVDD = 5.5 V

33

mW

DVDD = 3.6 V

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