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LM7301 Datasheet(PDF) 4 Page - Texas Instruments

Part # LM7301
Description  DAC082S085 8-Bit Micro Power DUAL Digital-to-Analog Converter With Rail-to-Rail Output
PDF  33 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

LM7301 Datasheet(HTML) 4 Page - Texas Instruments

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1
VA
10
SCLK
2
VOUTA
9
SYNC
3
VOUTB
8
DIN
4
NC
7
VREFIN
5
NC
6
GND
Not to scale
Exposed Thermal Pad
1
VA
10
SCLK
2
VOUTA
9
SYNC
3
VOUTB
8
DIN
4
NC
7
VREFIN
5
NC
6
GND
4
DAC082S085
SNAS365G – MAY 2006 – REVISED JUNE 2016
www.ti.com
Product Folder Links: DAC082S085
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
6 Pin Configuration and Functions
DSC Package
10-Pin WSON
Top View
DGS Package
10-Pin VSSOP
Top View
Pin Functions
PIN
TYPE
DESCRIPTION
NO.
NAME
1
VA
Supply
Power supply input. Must be decoupled to GND.
2
VOUTA
Analog Output
Channel A analog output voltage.
3
VOUTB
Analog Output
Channel B analog output voltage.
4
NC
—
Not connected
5
NC
—
Not connected
6
GND
Ground
Ground reference for all on-chip circuitry.
7
VREFIN
Analog Input
Unbuffered reference voltage shared by all channels. Must be decoupled
to GND.
8
DIN
Digital Input
Serial data input. Data is clocked into the 16-bit shift register on the falling
edges of SCLK after the fall of SYNC.
9
SYNC
Digital Input
Frame synchronization input for the data input. When this pin goes low, it
enables the input shift register and data is transferred on the falling edges
of SCLK. The DAC is updated on the 16th clock cycle unless SYNC is
brought high before the 16th clock, in which case the rising edge of
SYNC acts as an interrupt and the write sequence is ignored by the DAC.
10
SCLK
Digital Input
Serial clock input. Data is clocked into the input shift register on the falling
edges of this pin.
PAD
PAD
Ground
Exposed die attach pad can be connected to ground or left floating.
Soldering the pad to the PCB offers optimal thermal performance and
enhances package self-alignment during reflow.



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