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ISO7320CD Datasheet(PDF) 16 Page - Texas Instruments

Part # ISO7320CD
Description  ISO732x Robust EMC, Low Power, Dual-Channel Digital Isolators
PDF  27 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

ISO7320CD Datasheet(HTML) 16 Page - Texas Instruments

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ISO7320C, ISO7320FC, ISO7321C, ISO7321FC
SLLSEK8C – JANUARY 2015 – REVISED APRIL 2015
www.ti.com
Typical Application (continued)
9.2.1 Design Requirements
9.2.1.1 Typical Supply Current Equations
ISO7320:
ISO7321:
At VCC1 = VCC2 = 5 V
At VCC1 = VCC2 = 5 V
•
ICC1 = 0.3838 + (0.0431 x f)
•
ICC1 and ICC2 = 1.5877 + (0.066 x f) + (0.00123 x f x CL)
•
ICC2 = 2.74567 + (0.08433 x f) + (0.01 x f x CL)
At VCC1 = VCC2 = 3.3 V
At VCC1 = VCC2 = 3.3 V
•
ICC1 = 0.2394 + (0.02355 x f)
•
ICC1 and ICC2 = 1.187572 + (0.019399 x f) + (0.0019029 x
f x CL)
•
ICC2 = 2.10681 + (0.04374 x f) + (0.007045 x f x CL)
ICC1 and ICC2 are typical supply currents measured in mA, f is data rate measured in Mbps, CL is the capacitive
load measured in pF.
9.2.2 Detailed Design Procedure
9.2.2.1 Electromagnetic Compatibility (EMC) Considerations
Many applications in harsh industrial environment are sensitive to disturbances such as electrostatic discharge
(ESD), electrical fast transient (EFT), surge and electromagnetic emissions. These electromagnetic disturbances
are regulated by international standards such as IEC 61000-4-x and CISPR 22. Although system-level
performance and reliability depends, to a large extent, on the application board design and layout, the ISO732x
incorporate many chip-level design improvements for overall system robustness. Some of these improvements
include:
•
Robust ESD protection cells for input and output signal pins and inter-chip bond pads.
•
Low-resistance connectivity of ESD cells to supply and ground pins.
•
Enhanced performance of high voltage isolation capacitor for better tolerance of ESD, EFT and surge events.
•
Bigger on-chip decoupling capacitors to bypass undesirable high energy signals through a low impedance
path.
•
PMOS and NMOS devices isolated from each other by using guard rings to avoid triggering of parasitic
SCRs.
•
Reduced common mode currents across the isolation barrier by ensuring purely differential internal operation.
9.2.3 Application Performance Curves
Typical eye diagrams of ISO732x below indicate low jitter and wide open eye at the maximum data rate of 25
Mbps.
Figure 19. Eye Diagram at 25 Mbps, 3.3 V and 25°C
Figure 18. Eye Diagram at 25 Mbps, 5 V and 25°C
16
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: ISO7320C ISO7320FC ISO7321C ISO7321FC



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