LM833

SLOS481B – JULY 2010 – REVISED OCTOBER 2014

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC+

Supply voltage(2)

18

V

VCC–

Supply voltage(2)

–18

V

VCC+ – VCC–

Supply voltage

36

V

Input voltage, either input(2)(3)

VCC–

VCC+

V

Input current(4)

±10

mA

Duration of output short circuit(5)

Unlimited

TJ

Operating virtual junction temperature

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–.

(3)

The magnitude of the input voltage must never exceed the magnitude of the supply voltage.

(4)

Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless

some limiting resistance is used.

(5)

The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure the

maximum dissipation rating is not exceeded.

7.2 Handling Ratings

PARAMETER

DEFINITION

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

Human-Body Model (HBM)(1)

0

2.5

V(ESD)

kV

Charged-Device Model (CDM)(2)

0

1.5

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC–

–5

–18

Supply voltage

V

VCC+

5

18

TA

Operating free-air temperature range

–40

85

°C

7.4 Thermal Information

LM833

THERMAL METRIC(1)

D

DGK

P

UNIT

8 PINS

R

θJA

Junction-to-ambient thermal resistance(2)(3)

97

172

85

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

(2)

Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) – TA) / θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

(3)

The package thermal impedance is calculated in accordance with JESD 51-7.

4

Submit Documentation Feedback

Copyright © 2010–2014, Texas Instruments Incorporated

Product Folder Links: LM833