www.ti.com

EXAMPLE STENCIL DESIGN

32X (0.6)

32X (0.24)

28X (0.5)

(4.8)

(4.8)

(0.775) TYP

(0.775) TYP

4X (1.35)

4X (1.35)

(R0.05) TYP

WQFN - 0.8 mm max height

RTV0032A

PLASTIC QUAD FLATPACK - NO LEAD

4224386/B 04/2019

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL

SCALE: 20X

EXPOSED PAD 33

76% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SYMM

SYMM

1

8

9

16

17

24

25

32

33