VIN

GND

6

5

EN1

4

POR

1

VOUT1

2

GND

3

N/C

Top View

7

8

9

10

VOUT2

EN2

SET

CBYP

LP3996

www.ti.com

SNVS360D – NOVEMBER 2006 – REVISED OCTOBER 2013

Connection Diagram

Figure 1. WSON-10 Package

See Package Number DSC0010A

Table 1. Additional Device Information (1)

VOUT1/VOUT2 (V)

ORDER NUMBER

0.8/3.3

LP3996SD/X-0833/NOPB

1.0/1.8

LP3996SD/X-1018/NOPB

1.5/2.5

LP3996SD/X-1525/NOPB

1.8/3.3

LP3996SD/X-1833/NOPB

2.5/3.3

LP3996SD/X-2533/NOPB

2.8/2.8

LP3996SD/X-2828/NOPB

3.0/3.0

LP3996SD/X-3030/NOPB

3.0/3.3

LP3996SD/X-3033/NOPB

3.3/0.8

LP3996SD/X-3308/NOPB

3.3/3.3

LP3996SD/X-3333/NOPB

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Copyright © 2006–2013, Texas Instruments Incorporated

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