LP3996

SNVS360D – NOVEMBER 2006 – REVISED OCTOBER 2013

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ABSOLUTE MAXIMUM RATINGS

(1) (2)

Input Voltage to GND

–0.3V to 6.5V

VOUT1, VOUT2 EN1 and EN2 Voltage to GND

–0.3V to (VIN + 0.3V) with 6.5V

(max)

POR to GND

–0.3V to 6.5V

Junction Temperature (TJ-MAX)

150°C

Lead/Pad Temp(3)

235°C

Storage Temperature

–65°C to 150°C

Continuous Power Dissipation Internally Limited(4)

Human Body Model

2.0kV

ESD Rating(5)

Machine Model

200V

(1)

All Voltages are with respect to the potential at the GND pin.

(2)

Absolute Maximum Ratings are limits beyond which damage can occur. Recommended Operating Conditions are conditions under

which operation of the device is ensured. Recommended Operating Conditions do not imply ensured performance limits. For ensured

performance limits and associated test conditions, see the Electrical Characteristics tables.

(3)

For detailed soldering specifications and information, please refer to Texas Instruments Application Note AN-1187, Leadless Leadframe

Package.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage.

(5)

The human body model is 100 pF discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF capacitor

discharged directly into each pin.

RECOMMENDED OPERATING CONDITIONS

(1) (2)

Input Voltage

2.0V to 6.0V

EN1, EN2, POR Voltage

0 to (VIN + 0.3V) to 6.0V (max)

Junction Temperature

–40°C to 125°C

Ambient Temperature TA Range

(3)

–40°C to 85°C

(1)

Absolute Maximum Ratings are limits beyond which damage can occur. Recommended Operating Conditions are conditions under

which operation of the device is ensured. Recommended Operating Conditions do not imply ensured performance limits. For ensured

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All Voltages are with respect to the potential at the GND pin.

(3)

The maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op) = 125°C), the

maximum power dissipation of the device in the application (PD(max)), and the junction to ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA(max) = TJ(max-op) - (θJA × PD(max)).

THERMAL PROPERTIES

(1)

Junction-To-Ambient Thermal Resistance(2)

θJA WSON-10 Package

55°C/W

(1)

Absolute Maximum Ratings are limits beyond which damage can occur. Recommended Operating Conditions are conditions under

which operation of the device is ensured. Recommended Operating Conditions do not imply ensured performance limits. For ensured

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

Junction-to-ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power

dissipation is possible; special care must be paid to thermal dissipation issues in board design.

4

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