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LP5907 Datasheet(PDF) 15 Page - Texas Instruments |
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LP5907 Datasheet(HTML) 15 Page - Texas Instruments |
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15 / 34 page ![]() EN IN OUT GND 1 PF 1 PF INPUT ENABLE GND OUTPUT LP5907-Q1 15 LP5907-Q1 www.ti.com SNVSA34E – SEPTEMBER 2014 – REVISED DECEMBER 2019 Product Folder Links: LP5907-Q1 Submit Documentation Feedback Copyright © 2014–2019, Texas Instruments Incorporated 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information Figure 20 shows the typical application circuit for the LP5907-Q1. Input and output capacitances may need to be increased above the 1 µF minimum for some applications. 8.2 Typical Application Figure 20. LP5907-Q1 Typical Application 8.2.1 Design Requirements DESIGN PARAMETER EXAMPLE VALUE Input voltage range 2.2 to 5.5 V Output voltage 1.8 V Output current 200 mA Output capacitor range 0.7 to 10 µF Input/output capacitor ESR range 5 to 500 mΩ 8.2.2 Detailed Design Procedure To begin the design process, determine the following: • Available input voltage range • Output voltage needed • Output current needed • Input and Output capacitors 8.2.2.1 Power Dissipation and Device Operation The permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the device, to the ultimate heat sink, the ambient environment. Thus, the power dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces between the die junction and ambient air. |
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