6

LP5907-Q1

SNVSA34E – SEPTEMBER 2014 – REVISED DECEMBER 2019

www.ti.com

Product Folder Links: LP5907-Q1

Submit Documentation Feedback

Copyright © 2014–2019, Texas Instruments Incorporated

(1)

All voltages are with respect to the device GND terminal, unless otherwise stated.

(2)

Minimum and maximum limits are ensured through test, design, or statistical correlation over the junction temperature (TJ) range of

–40°C to 125°C, unless otherwise stated. Typical values represent the most likely parametric norm at TA = 25°C, and are provided for

reference purposes only.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See Application and

Implementation.

(4)

Quiescent current is defined here as the difference in current between the input voltage source and the load at VOUT.

(5)

Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device.

(6)

Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its

nominal value.

(7)

Short-circuit current (ISC) for the LP5907-Q1 is equivalent to current limit. To minimize thermal effects during testing, ISC is measured

with VOUT pulled to 100 mV below its nominal voltage.

(8)

This specification is verified by design.

(9)

There is a 1-MΩ resistor between EN and ground on the device.

6.5 Electrical Characteristics

VIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA, CIN = 1 µF, COUT = 1 µF (unless otherwise noted)

(1) (2) (3)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

GENERAL

VIN

Input voltage

TA = 25°C

2.2

5.5

V

ΔVOUT

Output voltage tolerance

VIN = (VOUT(NOM) + 1 V) to

5.5 V,

IOUT = 1 mA to 250 mA

SOT-23 package

VOUT ≥ 1.8 V

–2

2

%VOUT

VOUT < 1.8 V

–3

3

VIN = (VOUT(NOM) + 1 V) to

5.5 V,

IOUT = 1 mA to 250 mA

X2SON package

VOUT > 2.5 V

–2

2

VOUT ≤ 2.5 V

–3

3

Line regulation

VIN = (VOUT(NOM) + 1 V) to 5.5 V,

IOUT = 1 mA

0.02

%/V

Load regulation

IOUT = 1 mA to 250 mA

0.001

%/mA

ILOAD

Output load current

0

250

mA

IQ

Quiescent current(4)

VEN = 1.2 V, IOUT = 0 mA

12

25

µA

VEN = 1.2 V, IOUT = 250 mA

250

425

VEN = 0.3 V (Disabled)

0.2

1

IG

Ground current(5)

VEN = 1.2 V, IOUT = 0 mA

14

µA

VDO

Dropout voltage(6)

IOUT = 100 mA

50

mV

IOUT = 250 mA

250

ISC

Short-circuit current limit

TA = 25°C

(7)

250

500

mA

PSRR

Power-supply rejection ratio(8)

f = 100 Hz, IOUT = 20 mA

90

dB

f = 1 kHz, IOUT = 20 mA

82

f = 10 kHz, IOUT = 20 mA

65

f = 100 kHz, IOUT = 20 mA

60

eN

Output noise voltage(8)

BW = 10 Hz to 100 kHz

IOUT = 1 mA

10

µVRMS

IOUT = 250 mA

6.5

RAD

Output automatic discharge

pulldown resistance

VEN < VIL (output disabled)

230

Ω

TSD

Thermal shutdown

TJ rising

160

°C

Thermal hysteresis

TJ falling from shutdown

15

LOGIC INPUT THRESHOLDS

VIL

Low input threshold

VIN = 2.2 V to 5.5 V,

VEN falling until the output is disabled

0.4

V

VIH

High input threshold

VIN = 2.2 V to 5.5 V,

VEN rising until the output is enabled

1.2

V

IEN

Input current at EN pin(9)

VEN = 5.5 V and VIN = 5.5 V

5.5

µA

VEN = 0 V and VIN = 5.5 V

0.001