5.4 Thermal Information

PACKAGE

PINS

THERMAL METRIC(1)

UNIT

RθJA

RθJC(top)

RθJB

ΨJT

ΨJB

RθJC(bot)

PW (TSSOP)

14

145.7

76.5

102.0

18.8

100.7

N/A

°C/W

BQA (WQFN)

14

91.3

99.4

61.0

14.5

60.8

37.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

-40°C to 125°C

UNIT

MIN

TYP

MAX

VOH

IOH = -50µA

4.5V

4.4

4.499

V

5.5V

5.4

5.499

IOH = -24mA

4.5V

3.7

4.19

IOH = -24mA

5.5V

4.7

5.22

IOH = -50mA

5.5V

3.85

4.9

IOH = -75mA

5.5V

3.85

4.57

VOL

IOL = 50µA

4.5V

0.001

0.1

V

5.5V

0.001

0.1

IOL = 24mA

4.5V

0.16

0.5

IOL = 24mA

5.5V

0.14

0.5

IOL = 50mA

5.5V

0.3

1.65

IOL = 75mA

5.5V

0.47

1.65

II

VI = 5.5V or GND

0V to 5.5V

±0.008

±1

µA

ICC

VI = VCC or GND, IO = 0

5.5V

0.1

20

µA

ΔICC

VI = VCC – 2.1V; Any Input

4.5V to 5.5V

0.1

1.5

mA

CI

VI = VCC or GND

5V

2

pF

CPD

CL = 50pF, F = 1MHz

5V

63

pF

5.6 Timing Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETE

R

DESCRIPTION

CONDITION

VCC

-40°C to 125°C

UNIT

MIN

MAX

fCLOCK

Clock frequency

5V

173

MHz

tW

Pulse duration

PRE or CLR low

5V

7

ns

tW

Pulse duration

CLK

5V

5.8

ns

tSU

Setup time

Data before CLK edge

5V

4

ns

tSU

Setup time

PRE or CLR low inactive

5V

0.5

ns

tH

Hold time

Data after CLK edge

5V

1

ns

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