www.ti.com

PACKAGE OUTLINE

C

SEE TERMINAL

DETAIL

20X 0.25

0.15

1.7 0.05

20X 0.5

0.3

0.8 MAX

(DIM A) TYP

OPT 02 SHOWN

0.05

0.00

16X 0.4

4X

1.6

A

3.1

2.9

B

3.1

2.9

0.25

0.15

0.5

0.3

WQFN - 0.8 mm max height

RUK0020B

PLASTIC QUAD FLATPACK - NO LEAD

4222676/A 02/2016

DIMENSION A

OPTION 01

(0.1)

OPTION 02

(0.2)

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

5

11

15

6

10

20

16

(OPTIONAL)

PIN 1 ID

0.1

C A

B

0.05

EXPOSED

THERMAL PAD

21

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 4.000

DETAIL

OPTIONAL TERMINAL

TYPICAL