AMC1200, AMC1200B

SBAS542D – APRIL 2011 – REVISED JULY 2015

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Table of Contents

7.4

Device Functional Modes........................................ 13

1

Features .................................................................. 1

8

Application and Implementation ........................ 15

2

Applications ........................................................... 1

8.1

Application Information............................................ 15

3

Description ............................................................. 1

8.2

Typical Applications ................................................ 15

4

Revision History..................................................... 2

9

Power Supply Recommendations ...................... 18

5

Pin Configuration and Functions ......................... 3

10

Layout................................................................... 18

6

Specifications......................................................... 4

10.1

Layout Guidelines ................................................. 18

6.1

Absolute Maximum Ratings ..................................... 4

10.2

Layout Example .................................................... 19

6.2

ESD Ratings.............................................................. 4

11

Device and Documentation Support ................. 20

6.3

Recommended Operating Conditions ....................... 4

11.1

Documentation Support ........................................ 20

6.4

Thermal Information .................................................. 4

11.2

Related Links ........................................................ 20

6.5

Electrical Characteristics........................................... 5

11.3

Community Resources.......................................... 20

6.6

Typical Characteristics .............................................. 6

11.4

Trademarks ........................................................... 20

7

Detailed Description ............................................ 11

11.5

Electrostatic Discharge Caution ............................ 20

7.1

Overview ................................................................. 11

11.6

Glossary ................................................................ 20

7.2

Functional Block Diagram ....................................... 11

12

Mechanical, Packaging, and Orderable

7.3

Feature Description................................................. 11

Information ........................................................... 21

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (September 2013) to Revision D

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

Changes from Revision B (August 2012) to Revision C

Page

•

Deleted device graphic ........................................................................................................................................................... 1

•

Added DWV (SOIC-9) package to document......................................................................................................................... 1

•

Changed last paragraph of Description section ..................................................................................................................... 1

•

Added DWV pin out drawing .................................................................................................................................................. 3

•

Added DWV column to Thermal Information table ................................................................................................................. 4

•

Added row for DWV package to L(I01) and L(I02) parameters in Package Characteristics table ....................................... 12

Changes from Revision A (August 2011) to Revision B

Page

•

Changed Isolation Voltage feature bullet................................................................................................................................ 1

•

Added AMC1200B device to data sheet ................................................................................................................................ 1

•

Changed title for Figure 25 ................................................................................................................................................... 10

•

Changed CTI parameter minimum value in Electrical Characteristics from

≥ 175 to ≥ 400................................................. 12

Changes from Original (April 2011) to Revision A

Page

•

Changed sign for maximum junction temperature from minus to plus (typo)......................................................................... 4

•

Added "0.5-V step" to test condition for Rise/fall time parameter .......................................................................................... 5

•

Changed Figure 12 ................................................................................................................................................................. 6

•

Changed Figure 13 ................................................................................................................................................................. 7

•

Changed surge immunity parameter from ±4000 to ±6000.................................................................................................. 12

2

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