4

AMC1100

SBAS562B – APRIL 2012 – REVISED DECEMBER 2019

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6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

TA

Operating ambient temperature range

–40

105

°C

VDD1

High-side power supply

4.5

5.0

5.5

V

VDD2

Low-side power supply

2.7

5.0

5.5

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

AMC1100

UNIT

DUB (SOP)

DWV (SOIC)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

75.1

102.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

61.6

49.8

°C/W

RθJB

Junction-to-board thermal resistance

39.8

56.6

°C/W

ψJT

Junction-to-top characterization parameter

27.2

16.0

°C/W

ψJB

Junction-to-board characterization parameter

39.4

55.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

PD

Maximum power dissipation

(both sides)

VDD1 = VDD2 = 5.5 V

82.5

mW

VDD1 = 5.5 V, VDD2 = 3.6 V

65.6

PD1

Maximum power dissipation

(high-side supply)

VDD1 = 5.5 V

44.0

mW

PD2

Maximum power dissipation

(low-side supply)

VDD2 = 5.5 V

38.5

mW

VDD2 = 3.6 V

21.6