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CC1350 Datasheet(PDF) 71 Page - Texas Instruments

Part # CC1350
Description  CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU
PDF  79 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

CC1350 Datasheet(HTML) 71 Page - Texas Instruments

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PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2025
PACKAGING INFORMATION
Orderable part number
Status
(1)
Material type
(2)
Package | Pins
Package qty | Carrier
RoHS
(3)
Lead finish/
Ball material
(4)
MSL rating/
Peak reflow
(5)
Op temp (°C)
Part marking
(6)
CC1312R1F3RGZR
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
Call TI | Nipdauag |
Nipdau | Full Nipdau
Level-3-260C-168 HR
-40 to 105
CC1312
R1F3
CC1312R1F3RGZR.A
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
Call TI
Level-3-260C-168 HR
-40 to 105
CC1312
R1F3
CC1312R1F3RGZR.B
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
Call TI
Level-3-260C-168 HR
-40 to 105
CC1312
R1F3
CC1312R1F3RGZRG4
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
NIPDAU
Level-3-260C-168 HR
-40 to 105
CC1312
R1F3
CC1312R1F3RGZRG4.A
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
NIPDAU
Level-3-260C-168 HR
-40 to 105
CC1312
R1F3
CC1312R1F3RGZRG4.B
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
NIPDAU
Level-3-260C-168 HR
-40 to 105
CC1312
R1F3
CC1312R1F3RGZT
Active
Production
VQFN (RGZ) | 48
250 | SMALL T&R
Yes
FULL NIPDAU |
NIPDAUAG | NIPDAU
Level-3-260C-168 HR
-40 to 105
CC1312
R1F3
CC1312R1F3RGZT.A
Active
Production
VQFN (RGZ) | 48
250 | SMALL T&R
Yes
FULL NIPDAU
Level-3-260C-168 HR
-40 to 105
CC1312
R1F3
CC1312R1F3RGZT.B
Active
Production
VQFN (RGZ) | 48
250 | SMALL T&R
Yes
FULL NIPDAU
Level-3-260C-168 HR
-40 to 105
CC1312
R1F3
(1) Status: For more details on status, see our product life cycle.
(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.
(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
Addendum-Page 1



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