Package and PCB thermal data

VND920

20/26

Doc ID 7767 Rev 6

4

Package and PCB thermal data

4.1

SO-28 thermal data

Figure 21.

SO-28 PC board

Note:

Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm,

PCB thickness = 2 mm, Cu thickness = 35 µm, Copper areas: 0.5 cm2, 3 cm2, 6 cm2).

RthA = Thermal resistance Junction to Ambient with one chip ON

RthB = Thermal resistance Junction to Ambient with both chips ON and Pdchip1 =Pdchip2

RthC = Mutual thermal resistance

Table 13.

Thermal calculation according to the PCB heatsink area

Chip 1 Chip 2

Tjchip1

Tjchip2

Note

ON

OFF

RthA xPdchip1 +Tamb

RthC xPdchip1 +Tamb

OFF

ON

RthC xPdchip2 +Tamb

RthA xPdchip2 +Tamb

ON

ON

RthB x(Pdchip1 +Pdchip2)+ Tamb

RthB x(Pdchip1 +Pdchip2)+ Tamb

Pdchip1 =Pdchip2

ON

ON

(RthA xPdchip1)+ RthC xPdchip2 +Tamb (RthA xPdchip2)+ RthC xPdchip1 +Tamb Pdchip1 ≠ Pdchip2

Obsolete

Product(s)

- Obsolete

Product(s)