CSD87588N

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SLPS384D – MARCH 2013 – REVISED APRIL 2015

5 Specifications

5.1 Absolute Maximum Ratings

TA = 25°C (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN to PGND

–0.8

30

VSW to PGND

30

Voltage

VSW to PGND (10 ns)

32

V

TG to VSW

–20

20

BG to PGND

–20

20

IDM

Pulsed Current Rating(2)

50

A

PD

Power Dissipation(3)

6

W

Sync FET, ID = 45, L = 0.1 mH

101

EAS

Avalanche Energy

mJ

Control FET, ID = 26, L = 0.1 mH

34

TJ

Operating Junction

–55

150

°C

Tstg

Storage Temperature Range

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Pulse Duration

≤50 µs, duty cycle ≤0.01

(3)

Device mounted on FR4 material with 1 inch2 (6.45 cm2) Cu

5.2 Recommended Operating Conditions

TA = 25°C (unless otherwise noted)

MIN

MAX

UNIT

VGS

Gate Drive Voltage

4.5

16

V

VIN

Input Supply Voltage

24

V

ƒSW

Switching Frequency

CBST = 0.1 μF (min)

200

1500

kHz

No Airflow

25

A

Operating Current

With Airflow (200 LFM)

30

A

With Airflow + Heat Sink

35

A

TJ

Operating Temperature

125

°C

5.3 Thermal Information

TA = 25°C (unless otherwise stated)

THERMAL METRIC

MIN

TYP

MAX

UNIT

Junction-to-ambient thermal resistance (Min Cu) (1)

170

RθJA

Junction-to-ambient thermal resistance (Max Cu) (2) (1)

70

°C/W

Junction-to-case thermal resistance (Top of package) (1)

3.7

RθJC

Junction-to-case thermal resistance (PGND Pin)

(1)

1.25

(1)

RθJC is determined with the device mounted on a 1 inch

2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu pad on a 1.5 inches × 1.5 inches

(3.81 cm × 3.81 cm), 0.06 inch (1.52 mm) thick FR4 board. RθJC is specified by design while RθJA is determined by the user’s board

design.

(2)

Device mounted on FR4 material with 1 inch2 (6.45 cm2) Cu.

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