5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

VVS

Supply voltage

6

V

Analog Inputs, IN+,

IN–

Differential (VIN+ – VIN-)(2)

–40

40

V

Common-Mode (VIN+ + VIN-) / 2

–0.3

40

VVBUS

–0.3

40

V

VSDA

GND – 0.3

6

V

VSCL

GND – 0.3

VVS + 0.3

V

IIN

Input current into any pin

5

mA

IOUT

Open-drain digital output current

10

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

IN+ and IN– can have a differential voltage between –40 V and 40 V. However, the voltage at these pins must not exceed the range

–0.3 V to 40 V.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2500

V

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002, all pins(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input voltage

12

V

VVS

Operating supply voltage

3.3

V

TA

Operating free-air temperature

–40

125

°C

5.4 Thermal Information

THERMAL METRIC(1)

INA226

UNIT

DGS (VSSOP)

10 PINS

RθJA

Junction-to-ambient thermal resistance

144.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

53.3

°C/W

RθJB

Junction-to-board thermal resistance

80.4

°C/W

ΨJT

Junction-to-top characterization parameter

3.5

°C/W

YJB

Junction-to-board characterization parameter

78.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

INA226

SBOS547B – JUNE 2011 – REVISED SEPTEMBER 2024

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