ISO7740 datasheet(8/52 Pages) TI2

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5.4 Thermal Information

THERMAL METRIC(1)

ISO774x

UNIT

DW (SOIC)

DBQ (QSOP)

16 PINS

RθJA

Junction-to-ambient thermal resistance

83.4

109

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

54.4

°C/W

RθJB

Junction-to-board thermal resistance

51.9

°C/W

ψJT

Junction-to-top characterization parameter

19.1

14.2

°C/W

ψJB

Junction-to-board characterization parameter

47.5

51.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO7740

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 50-MHz 50% duty cycle

square wave

210

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

165

ISO7741

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 50-MHz 50% duty cycle

square wave

210

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

135

ISO7742

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 50-MHz 50% duty cycle

square wave

210

PD1

Maximum power dissipation (side-1)

105

PD2

Maximum power dissipation (side-2)

105

ISO7740, ISO7741, ISO7742

SLLSEP4J – MARCH 2016 – REVISED OCTOBER 2024

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