13.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

14 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (May 2020) to Revision H (June 2024)

Page

• Updated the number format for tables, figures, and cross-references throughout the document...................... 1

Changes from Revision F (February 2020) to Revision G (May 2020)

Page

• Added minimum driver rise/fall time specification of 240 ns to 8.13 Switching characteristics: Driver (500kbps

devices) ........................................................................................................................................................... 13

Changes from Revision E (October 2019) to Revision F (February 2020)

Page

• Added updated certification information in Safety-Related Certifications ..........................................................8

Changes from Revision D (May 2019) to Revision E (October 2019)

Page

• Added footnote to Pin functions table for NC pins .............................................................................................3

Changes from Revision C (April 2019) to Revision D (May 2019)

Page

• Added B part numbers throughout datasheet ....................................................................................................1

Changes from Revision B (November 2018) to Revision C (April 2019)

Page

• Added ISO1430, ISO1432, ISO1450, ISO1452 in Device Information table......................................................1

• Changed Device Features tables to Device Comparison table.......................................................................... 2

• Changed the position of Device Features tables ...............................................................................................2

• Added footnote to Pin Functions: Full-Duplex Device........................................................................................ 3

• Added footnote to Pin Functions: Half-Duplex Device........................................................................................4

• Added Typical curves for ISO143x and ISO145x in Section 7.16 ................................................................... 15

• Added Section 11.2.3 Application Curves and Section 11.2.3.1 Insulation Lifetime.........................................31

Changes from Revision A (August 2018) to Revision B (November 2018)

Page

• Changed status to production data ....................................................................................................................1

Changes from Revision * (July 2018) to Revision A (August 2018)

Page

• Changed the designator of common mode voltage in Recommended operating condition to VI ......................6

• Added test condition for CMTI in Electrical characteristics: Driver ..................................................................9

• Added test condition for CMTI in Electrical characteristics: Receiver.............................................................. 10

• Changed VTEST to VCM in the Common Mode Transient Immunity (CMTI)—Full Duplex and Common Mode

Transient Immunity (CMTI)—Half Duplex figures in the Parameter Measurement Information section........... 21

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Product Folder Links: ISO1450 ISO1452 ISO1410 ISO1412 ISO1430 ISO1432