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MP2236C Datasheet(PDF) 3 Page - Monolithic Power Systems

Part # MP2236C
Description  18V, 6A, High-Efficiency, FCCM Synchronous Step-Down Converter
PDF  21 Pages
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP2236C Datasheet(HTML) 3 Page - Monolithic Power Systems

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MP2236C
– 18V, 6A, FCCM SYNCHRONOUS STEP-DOWN CONVERTER
MP2236C Rev. 1.0
MonolithicPower.com
3
3/16/2022
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2022 MPS. All Rights Reserved.
PIN FUNCTIONS
Pin #
Name
Description
1
AGND
Analog ground. Connect AGND to GND using a short and wide PCB trace.
2
IN
Supply voltage. The MP2236C operates from a 3V to 18V input rail. Use a ceramic
capacitor to decouple the input rail. Connect the IN pin using a wide PCB trace.
3
SW
Switch output. Connect the SW pin using a wide PCB trace.
4
GND
System power ground. The GND pin is the regulated output voltage (VOUT
)’s reference
ground, and requires special consideration in the PCB layout. Connect GND to the ground
plane with copper traces and vias.
5
BST
Bootstrap. Connect a 0.1µF capacitor between SW and BST to form a floating supply
across the high-side MOSFET (HS-FET) driver.
6
EN
Enable. Drive the EN pin high to enable the MP2236C. EN has a 2M
Ω pull-down resistor
to GND.
7
VCC
Internal bias supply. Decouple the VCC pin with a 1µF capacitor. The VCC capacitor
should be placed close to VCC and GND.
8
FB
Feedback. Connect the FB pin to the external resistor divider
’s tap from the output to
GND to set VOUT.
ABSOLUTE MAXIMUM RATINGS (1)
VIN.................................................. -0.3V to +20V
VSW ................................. -0.3V (-6.5V for <10ns)
…………………….to VIN + 0.7V (25V for <25ns)
VBST........................................................VSW + 4V
VEN................................................................. 20V
All other pins ................................... -0.3V to +4V
Continuous power dissipation (TA = 25°C) (2) (5)
TSOT23-8 .................................................1.89W
Junction temperature ................................ 150°C
Lead temperature...................................... 260°C
Storage temperature .................-65°C to +150°C
ESD Ratings
Human body model (HBM) .....................±2000V
Charged device model (CDM) .................. ±750V
Recommended Operating Conditions (3)
Supply voltage (VIN) ............................ 3V to 18V
Output voltage (VOUT)......................... 0.6V to 8V
……………………………………or VIN x DMAX (4)
Operating junction temp (TJ).....-40°C to +125°C
Thermal Resistance
θJA
θJC
TSOT23-8
EVL2236C-J-00A (5) ................66........23....°C/W
JESD51-7 (6) ...........................100 ......55....°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature, TJ (MAX), the junction-to-
ambient
thermal
resistance,
θJA,
and
the
ambient
temperature, TA. The maximum allowable continuous power
dissipation at any ambient temperature is calculated by PD
(MAX) = (TJ (MAX) - TA) /
θJA. Exceeding the maximum
allowable power dissipation can generate an excessive die
temperature, which may cause the regulator to go into
thermal
shutdown.
Internal
thermal
shutdown
circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) For more information about DMAX, see the Low-Dropout (LDO)
Operation section on page 12.
5) Measured
on
the
EVL2236C-J-00A,
a
4-layer
PCB
(63.5mmx63.5mm).
6)
The value of θJA given in this table is only valid for comparison
with other packages and cannot be used for design purposes.
These values were calculated in accordance with JESD51-7,
and simulated on a specified JEDEC board. They do not
represent the performance obtained in an actual application .



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