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MP2236C Datasheet(PDF) 3 Page - Monolithic Power Systems |
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MP2236C Datasheet(HTML) 3 Page - Monolithic Power Systems |
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3 / 21 page ![]() MP2236C – 18V, 6A, FCCM SYNCHRONOUS STEP-DOWN CONVERTER MP2236C Rev. 1.0 MonolithicPower.com 3 3/16/2022 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2022 MPS. All Rights Reserved. PIN FUNCTIONS Pin # Name Description 1 AGND Analog ground. Connect AGND to GND using a short and wide PCB trace. 2 IN Supply voltage. The MP2236C operates from a 3V to 18V input rail. Use a ceramic capacitor to decouple the input rail. Connect the IN pin using a wide PCB trace. 3 SW Switch output. Connect the SW pin using a wide PCB trace. 4 GND System power ground. The GND pin is the regulated output voltage (VOUT )’s reference ground, and requires special consideration in the PCB layout. Connect GND to the ground plane with copper traces and vias. 5 BST Bootstrap. Connect a 0.1µF capacitor between SW and BST to form a floating supply across the high-side MOSFET (HS-FET) driver. 6 EN Enable. Drive the EN pin high to enable the MP2236C. EN has a 2M Ω pull-down resistor to GND. 7 VCC Internal bias supply. Decouple the VCC pin with a 1µF capacitor. The VCC capacitor should be placed close to VCC and GND. 8 FB Feedback. Connect the FB pin to the external resistor divider ’s tap from the output to GND to set VOUT. ABSOLUTE MAXIMUM RATINGS (1) VIN.................................................. -0.3V to +20V VSW ................................. -0.3V (-6.5V for <10ns) …………………….to VIN + 0.7V (25V for <25ns) VBST........................................................VSW + 4V VEN................................................................. 20V All other pins ................................... -0.3V to +4V Continuous power dissipation (TA = 25°C) (2) (5) TSOT23-8 .................................................1.89W Junction temperature ................................ 150°C Lead temperature...................................... 260°C Storage temperature .................-65°C to +150°C ESD Ratings Human body model (HBM) .....................±2000V Charged device model (CDM) .................. ±750V Recommended Operating Conditions (3) Supply voltage (VIN) ............................ 3V to 18V Output voltage (VOUT)......................... 0.6V to 8V ……………………………………or VIN x DMAX (4) Operating junction temp (TJ).....-40°C to +125°C Thermal Resistance θJA θJC TSOT23-8 EVL2236C-J-00A (5) ................66........23....°C/W JESD51-7 (6) ...........................100 ......55....°C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ (MAX), the junction-to- ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum allowable power dissipation can generate an excessive die temperature, which may cause the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) For more information about DMAX, see the Low-Dropout (LDO) Operation section on page 12. 5) Measured on the EVL2236C-J-00A, a 4-layer PCB (63.5mmx63.5mm). 6) The value of θJA given in this table is only valid for comparison with other packages and cannot be used for design purposes. These values were calculated in accordance with JESD51-7, and simulated on a specified JEDEC board. They do not represent the performance obtained in an actual application . |
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