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LOG114 Datasheet(PDF) 27 Page - Texas Instruments |
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LOG114 Datasheet(HTML) 27 Page - Texas Instruments |
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27 / 43 page ![]() 7.4.2 Layout Example A 1 + – A 3 + – A 2 + – I2 I1 V CM IN COM A 4 + – V O4 –IN 4 +IN 4 V+ V REF GND I 2 I 1 LOG114 V LOGOUT REF V REF A 5 – + V O5 +IN 5 –IN 5 R 2 R 3 V– R 1 R 4 R 5 I REF 1 F C 1 5V C 2 –5V Photodiode Figure 7-15. LOG114 Example Circuit V REF GND NC I 2 4 I 1 1 2 3 V O4 –IN 4 +IN 4 9 V LOGOUT 12 11 10 PAD GND C 2 V REF Place bypass capacitors as close to device as possible Consider using thermal vias for heatsinking V LOGOUT V– C 1 V+ R 2 R 3 Cutouts on ground planes underneath the device can reduce stray capacitance and leakage GND Photodiode R 5 GND R 4 V O4 R 1 V REF GND GND V REF Figure 7-16. LOG114 Layout Example www.ti.com LOG114 SBOS301B – MAY 2004 – REVISED MARCH 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 27 Product Folder Links: LOG114 |
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