OPA140 datasheet(4/56 Pages) TI2

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V+

OUT B

–IN B

+IN B

OUT A

–IN A

+IN A

V–

Figure 5-3. OPA2140: D Package, 8-Pin SOIC and

DGK Package, 8-Pin VSSOP (Top View)

V+

OUT B

–IN B

+IN B

OUT A

–IN A

+IN A

V–

Figure 5-4. OPA2140: DRG Package, 8-Pin SON

(Top View)

OUT A

±IN A

+IN A

V+

+ IN B

±IN B

OUT B

OUT D

±IN D

+IN D

V±

+ IN C

±IN C

OUT C

Figure 5-5. OPA4140: D Package, 14-Pin SOIC and PW Package, 14-Pin TSSOP (Top View)

Table 5-2. Pin Functions: OPA2140 and OPA4140

TYPE

DESCRIPTION

NAME

OPA2140

OPA4140

D (SOIC),

DGK (VSSOP),

DRG (SON)

D (SOIC),

PW (TSSOP)

+IN A

Input

Noninverting input, channel A

+IN B

Input

Noninverting input, channel B

+IN C

—

Input

Noninverting input, channel C

+IN D

—

Input

Noninverting input, channel D

–IN A

Input

Inverting input, channel A

–IN B

Input

Inverting input, channel B

–IN C

—

Input

Inverting input, channel C

–IN D

—

Input

Inverting input, channel D

OUT A

Output

Output, channel A

OUT B

Output

Output, channel B

OUT C

—

Output

Output, channel C

OUT D

—

Output

Output, channel D

V+

—

Positive (highest) power supply

V–

—

Negative (lowest) power supply

Thermal Pad

DRG Package

only

—

Thermal pad is internally connected to V−. Solder the thermal pad

to a heat spreading plane on the board connected to V−. For DRG

package only.

OPA140, OPA2140, OPA4140

SBOS498F – JUNE 2010 – REVISED MARCH 2023

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