OPA388 datasheet(6/50 Pages) TI2

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

VS = (V+) – (V–)

Single-supply

Dual-supply

±3

Signal input pins

Voltage

Common-mode

(V–) – 0.5

(V+) + 0.5

Differential

(V+) – (V–) + 0.2

Current

±10

Output short circuit(2)

Continuous

Temperature

Operating, TA

–55

150

°C

Junction, TJ

150

Storage, Tstg

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage, VS = (V+) – (V–)

Single-supply

2.5

5.5

Dual-supply

±1.25

±2.75

Specified temperature

–40

125

°C

6.4 Thermal Information: OPA388

THERMAL METRIC(1)

OPA388

UNIT

D (SOIC)

DBV (SOT-23)

DGK (VSSOP)

8 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

116

145.7

177

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

94.8

°C/W

RθJB

Junction-to-board thermal resistance

43.4

100

°C/W

ΨJT

Junction-to-top characterization parameter

12.8

24.7

9.9

°C/W

ΨJB

Junction-to-board characterization parameter

55.9

43.1

98.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA388, OPA2388, OPA4388

SBOS777D – NOVEMBER 2016 – REVISED JULY 2020

www.ti.com

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