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OPA317, OPA2317, OPA4317

SBOS682B – MAY 2013 – REVISED JUNE 2016

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Product Folder Links: OPA317 OPA2317 OPA4317

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA317

THERMAL METRIC(1)

OPA317

UNIT

D (SOIC)

DBV (SOT-23)

DCK (SC70)

8 PINS

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

140.1

220.8

298.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

89.8

97.5

65.4

°C/W

RθJB

Junction-to-board thermal resistance

80.6

61.7

97.1

°C/W

ψJT

Junction-to-top characterization parameter

28.7

7.6

0.8

°C/W

ψJB

Junction-to-board characterization parameter

80.1

61.1

95.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2317

THERMAL METRIC(1)

OPA2317

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

124

180.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

73.7

48.1

°C/W

RθJB

Junction-to-board thermal resistance

64.4

100.9

°C/W

ψJT

Junction-to-top characterization parameter

18

2.4

°C/W

ψJB

Junction-to-board characterization parameter

63.9

99.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4317

THERMAL METRIC(1)

OPA4317

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

83.8

120.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

70.7

34.3

°C/W

RθJB

Junction-to-board thermal resistance

59.5

62.8

°C/W

ψJT

Junction-to-top characterization parameter

11.6

1

°C/W

ψJB

Junction-to-board characterization parameter

37.7

56.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

°C/W