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OPA818

SBOS940A – MAY 2019 – REVISED MARCH 2020

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Product Folder Links: OPA818

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Copyright © 2019–2020, Texas Instruments Incorporated

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

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Wide Bandwidth Optical Front-end Reference Design

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation see the following:

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OPA818EVM User's Guide

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Theory of decompensated amplifiers and stabilization techniques

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Using a decompensated op amp for improved performance

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Transimpedance Considerations for High-Speed Amplifiers Application Report

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Maximizing the dynamic range of analog TIA front-end

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What You Need To Know About Transimpedance Amplifiers – Part 1

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What You Need To Know About Transimpedance Amplifiers – Part 2

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Training Video: How to Design Transimpedance Amplifier Circuits

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Training Video: High-Speed Transimpedance Amplifier Design Flow

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Training Video: How to Convert a TINA-TI Model into a Generic SPICE Model

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

12.5 Trademarks

E2E is a trademark of Texas Instruments.

12.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.